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Packaging

The Packaging and Integration Unit: hosts Europe’s experts in the field of micro-photonic packaging and integration technologies. It provides feasibility studies, assistance, services and training in packaging and integration of micro-optical components. In particular it provides access to expertise and technologies to heterogeneously integrate micro-optical components with opto- and micro-electronic devices, and to adequately package and seal hybrid micro-optical systems. 

The following ACTMOST partners are involved in this access unit:

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Contact

Mrs. Nathalie Debaes
Project support officer
ndebaes@actmost.eu
+32 2 629 10 18

Supported by

Supported by EU
Support by Cordis FP7
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